Pressurization coating systems, methods, and apparatuses

ABSTRACT

Exemplary pressurization and coating systems, methods, and apparatuses are described herein. In certain embodiments, pressurization systems, methods, and apparatuses are used in conjunction with coating systems, methods, and apparatuses to control pressure about a substrate after a coating material is applied to a surface of the substrate. An exemplary system includes a die tool configured to apply a coating material to a substrate passing through the die tool and a pressurization apparatus attached to the die tool and forming a pressurization chamber. The pressurization apparatus is configured to receive the substrate from the die tool and control pressure about the substrate in the pressurization chamber. In certain embodiments, the die tool forms a coating chamber and is configured to apply the coating material on at least one surface of the substrate in the coating chamber.

RELATED APPLICATIONS

This is a continuation application of U.S. patent application Ser. No.15/673,256 (Attorney Docket No. 19663.30), filed Aug. 9, 2017, andentitled “PRESSURIZATION COATING SYSTEMS, METHODS, AND APPARATUSES”,which is a continuation application of U.S. patent application Ser. No.15/076,495 (now Abandoned) (Attorney Docket No. 19663.29), filed Mar.21, 2016, and entitled “PRESSURIZATION COATING SYSTEMS, METHODS ANDAPPARATUSES”, which is a continuation application of U.S. patentapplication Ser. No. 12/166,223 (now U.S. Pat. No. 9,289,795) (AttorneyDocket No. 19663.2), filed Jul. 1, 2008, and entitled “PRESSURIZATIONCOATING SYSTEMS, METHODS, AND APPARATUSES”; the entire disclosures ofwhich are hereby incorporated herein, in their entirety, by reference.

BACKGROUND Background and Related Art

Conventional processes for applying a coating on a substrate surfacehave limitations. For example, some standard coating processes requirethe use of solvents, electrostatic adhesion, or final heating stages,which typically increase expenses and limit manufacturing throughput.

Further, certain conventional coating processes are practical forapplying only specific substances to specific substrates. For example, acoating process that utilizes high temperatures may not be practical forapplying a coating to a substrate that includes enough moisture that thehigh temperatures will cause moisture to turn to steam and “steam off”of the substrate and/or the coating. This “steam off” effect canintroduce defects in coatings and coated products. Consequently, the“steam off” effect may preclude the use of certain coating processesand/or substances with certain substrates such as some wood orwood-based products (e.g., decorative moldings or other finish carpentryproducts), for example.

BRIEF DESCRIPTION OF THE DRAWING

The accompanying drawings illustrate various embodiments of theprinciples described herein and are a part of the specification. Theillustrated embodiments are merely examples and do not limit the scopeof the disclosure or the claims.

FIG. 1 is a perspective view illustrating an exemplary pressurizationcoating system, according to principles described herein.

FIG. 2 is a view of an interior of the die tool included in thepressurization system of FIG. 1, according to principles describedherein.

FIG. 3 is a cut-away side view of the pressurization apparatus includedin the pressurization system of FIG. 1, according to principlesdescribed herein.

FIG. 4 is a perspective view of the pressurization apparatus included inthe pressurization system of FIG. 1, according to principles describedherein.

FIG. 5 is another perspective view of the pressurization apparatusincluded in the pressurization system of FIG. 1, according to principlesdescribed herein.

FIG. 6 is an exploded perspective view of the pressurization apparatusincluded in the pressurization system of FIG. 1, according to principlesdescribed herein.

FIG. 7 illustrates another exemplary pressurization and coating system,according to principles described herein.

FIG. 8 illustrates an exemplary pressurization and coating method,according to principles described herein.

DETAILED DESCRIPTION

Exemplary pressurization and coating systems, methods, and apparatusesfor use in applying a coating on a substrate surface are disclosed.Pressurization systems, methods, and apparatuses may be used as part ofsystems, methods, and apparatuses for applying a coating on a substratesurface. In certain implementations, the pressurization systems,methods, and apparatuses may help expand the capabilities of coatingsystems, methods, and apparatuses, such as by broadening the range ofsubstrates that may be practically coated and/or the coating materialsthat may be applied to substrates, and reducing or eliminatingoccurrences of errors and blemishes, for example.

According to principles disclosed herein, one or more suitable coatingmaterials may be applied to a substrate surface. Suitable coatingmaterials may include, but are not limited to, fluid-state materialssuch as liquid plastics, including plastics configured to adhere tospecific substrates such as wood. In certain embodiments, a coatingmaterial, including a coating material in a solid (e.g., pellet orpowder) state or a liquid state may be pretreated in preparation forapplication of the coating material to a substrate surface. This mayinclude heating the coating material. For instance, a coating materialin a solid state may be heated to a liquid state for application to thesubstrate surface.

A coating material may include, but is not limited to, acrylics,polyesters, polypropylenes, polyethylene, polyvinylchlorides (PVC),polyolefins, ABS, ASA, or an alloy of any of the above. Additionally,the coating material may include other materials, including, but notlimited to, color pigments, ultraviolet stabilizers, emulsifiers,rubbers, and other types of stabilizers potentially helpful for creatinga durable and/or decorative finish to a coating applied to a substrate.A bulk carrying material, which may function primarily as a binder tothe substrate, may include, but is not limited to, acrylics, polyesters,etc. In some coating applications, the bulk carrying material typicallycomprises between approximately seventy to eighty percent (70-80%) ofthe coating material, the pigmentation typically includes approximatelyten percent (10%) of the coating material, and the remaining ten totwenty percent (10-20%) of the coating material includes ultravioletstabilizers, emulsifiers, and any of the other elements mentioned above.

A coating material may be applied to a surface of any suitable substrateaccording to principles described herein. Examples of substrates thatmay be coated include, but are not limited to, wood surfaces, wood,clear wood, natural wood, wood hybrid products, wood-based products,medium-density fiberboard (MDF), particle board, plastics, metals,metal-type objects, glass, glass-based products, fiberglass, naturalproducts, synthetic products, and any other suitable object that issubstantially rigid so that its shape is maintained as it is subjectedto a coating process. In certain coating applications, the principlesdescribed herein may be used to apply a coating such as a molten plasticon a surface of a substrate such as a wood product, or the like.

Turning now to the Figures. FIG. 1 illustrates an exemplarypressurization coating system 100 (or simply “system 100”). System 100includes a die tool 110 and a pressurization apparatus 120, which may beattached to one another as shown in FIG. 1. A substrate 130 may bepassed through the die tool 110 and the pressurization apparatus 120.FIG. 1 shows a portion of a substrate 130 that has passed through dietool 110 and pressurization apparatus 120 and exited from thepressurization apparatus 120. In the illustrated example, substrate 130includes a decorative finish carpentry product (e.g., a molding having adecorative profile). This is illustrative only. System 100 may beconfigured to apply one or more coating materials to any suitablesubstrate, including any of those listed above.

Die tool 110 may be configured to apply a coating material to substrate130 as the substrate 130 passes through the die tool 110. Die tool 110may include any mechanism(s) and employ any technologies suitable forapplying a coating material to the substrate 130. In certainembodiments, for example, a liquid coating material may be collected andextruded on at least one surface of the substrate 130 within the dietool 110.

FIG. 2 illustrates a first die shell 210 and a second die shell 220 thatmay be attached to one another to form at least a part of the die tool110 having a cavity 230 therein. As shown in FIG. 2, first die shell 210and second die shell 220 may each form an aperture 240 through which thesubstrate 130 may pass. In the illustrated example, apertures 240 areshaped to fit a profile of the substrate 130.

The cavity 230 formed within die tool 110, or at least a portion of thecavity 230, may be referred to as a coating chamber within which acoating material may be applied to the substrate 130. In certainembodiments, the die tool 110 may be configured to receive a coatingmaterial, such as by way of a coating material feed 250. The coatingmaterial may accumulate in at least a portion of the coating chamberwithin the die tool 110. As the substrate 130 passes through the coatingchamber, the coating material is applied to at least one surface of thesubstrate 130.

In certain embodiments, the die tool 110 may be heated. The die tool 110may be heated in any suitable manner, such as by being connected to aheat source by a heating element 260. In certain embodiments, the dietool 110 may be configured to be heated to a temperature that issuitable for applying a coating material to the substrate 130. Forexample, where the die tool 110 is configured to extrude a coatingmaterial on at least one surface of the substrate 130 with the coatingchamber, the die tool 110 may be heated to a temperature that isconducive to the extrusion.

While FIG. 2 illustrates exemplary components of a die tool 110, theexample is illustrative only. Other suitable die tools 110 and coatingapparatuses or processes may be used in other embodiments. For example,die tool 110 may include and/or employ any suitable mechanisms and/orprocesses for applying a coating material to a substrate 130.

In certain implementations, a coating material may be applied to thesubstrate 130 in any of the ways described in U.S. Pat. No. 6,660,086,granted Dec. 9, 2003, and titled “Method and Apparatus for Extruding aCoating Upon a Substrate Surface.” the content of which is herebyincorporated by reference in its entirety. According to the '086 patent,a coating material may be heated to a fluid state and provided to a die(e.g., see reference number 56 in FIGS. 3, 4, and 9 of the '086 patent),which includes a cavity within which the coating material may accumulatein fluid state. The die includes an aperture that has a two dimensionalprofile matching that of the substrate. The dimensions of the substratemay be adjusted to account for the aperture profile and the coatingfinish to be applied on the substrate. The substrate passes through thedie in conformance to the profile matching the die. As the substratepasses through the die profile, the coating material is applied to thesurface of the substrate in a controlled manner, as described in the'086 patent. In certain implementations, the die tool 110 may compriseand/or be configured like the die described in the '086 patent (e.g.,see reference number 56 in FIGS. 3, 4, and 9 of the '086 patent).

In certain implementations, as a fluid-state coating material isprovided to the die tool 110 and the substrate 130 passes through thedie tool 110, a pressurized environment may be formed within the dietool 110. In certain coating applications, the pressure level may beapproximately two hundred to eight hundred pounds per square inch(200-800 psi) within the die tool 110. In addition, the environmentwithin the die may be subjected to high temperatures. This is due atleast in part to the coating material being heated to a fluid stateand/or the die tool 110 being heated. In certain coating applications,the temperatures within the die tool 110 may reach approximately threehundred to six hundred degrees Fahrenheit (300-600° F.). These rangesare illustrative only and not limiting. Other temperature and pressureranges may occur in other coating applications and embodiments.

Without the pressurization apparatus 120 attached to the die tool 110 asshown in FIG. 1, as the coated substrate 130 exits the exit aperture 240of the die tool 110, the coated substrate 130 may be subjected to asudden change in environment, including a sudden change in pressure fromthe pressurized environment in the die tool 110 to atmospheric pressureand/or a sudden decrease in environmental temperature from the hightemperatures in the die tool 110 to room temperatures, for example. Oneor more of these sudden changes in environmental pressure and/ortemperature can significantly affect the quality of a coating that hasbeen applied on a surface of the substrate 130. For example, varioussubstrates 130 may include different amounts of moisture. The moremoisture present in a substrate 130, the more susceptible the substrate130 may be to reacting to sudden environmental changes. For instance,when such a substrate 130 is subjected to a high temperature and highpressure environment such as may exist in the die tool 110, the highpressure may prevent the moisture from turning to steam at the hightemperatures. That is, the high pressure may raise the boiling point forthe moisture such that the high temperatures do not cause the moistureto boil in the die tool 110. However, when the substrate 130 exits thedie tool 110 and is suddenly subjected to atmospheric pressure withouthaving time to sufficiently cool, at least some of the moisture may turnto steam and “steam off” of the substrate 130. This can deform thecoating, including introducing bubbles, ripples, and holes in thecoating. Accordingly, while a coating process may be well suited forcoating some substrates 130 with certain coating materials, the samecoating process may not be a practical choice for coating othersubstrates 130 that include relatively higher amounts of moisture, orfor using certain coating materials.

Pressurization apparatus 120 may be implemented in system 100 as shownin FIG. 1 and may in certain examples broaden the types of substrates130 and/or coating materials that may be used in a coating process,including making a pressurization coating process a practical option forapplying a coating to a substrate 130 having moisture content that couldhave otherwise “steamed off” if the pressurization apparatus 120 was notemployed in the coating process.

As shown in FIG. 1, the pressurization apparatus 120 may be attached todie tool 110 and configured to receive the substrate 130 from the dietool 110 as the substrate 130 exits from the die tool 110. Thepressurization apparatus 120 may form a pressurization chamber and mayinclude and/or employ any suitable technologies for pressurizing and/orcontrolling pressure within the pressurization chamber. For example, airor one or more other gaseous elements may be forced into thepressurization chamber through one or more apertures in thepressurization apparatus 120. FIG. 1 shows an aperture 140 formed withina side plate of the pressurization apparatus 120. One or morepressurization tools such as an air hose and a pressure gauge may beattached to the aperture 140 such that the air pressure in thepressurization chamber may be controlled and monitored. An aircompressor or other suitable air source may be used to force air throughthe aperture 140 and into the pressurization chamber. In certainembodiments, another aperture may be included in the opposite side plateof the pressurization apparatus 120, and air may be forced into thepressurization chamber through both apertures 140. These examples ofpressurizing the pressure chamber are illustrative only. Other suitablepressurization tools and processes may be included and/or utilized inother embodiments.

The pressure in the pressurization chamber of the apparatus 120 may beset to and/or maintained at any suitable level. In certain applications,pressure in the pressurization chamber may be maintained at a levelbetween atmospheric pressure and a pressure within the coating chamberof the die tool 110. For certain exemplary applications, pressure levelsranging from approximately five to eighty pounds per square inch (5-80psi) are used. In other exemplary applications, pressure levels rangingfrom approximately ten to fifty pounds per square inch (10-50 psi) areused. However, these ranges are illustrative only and not limiting.Other suitable pressure levels or ranges of pressure levels may be usedfor other applications.

The pressurization apparatus 120 may be attached to the die tool 110 inany manner suitable for maintaining a controlled air pressure within thepressurization chamber. An attachment of the apparatus 120 to the dietool 110 may form a seal (e.g., an air pressure seal) between the outerface of the die tool 110 (e.g., an outer face of a die plate of the dietool 110) and an outer surface of the pressurization apparatus 120. FIG.3 illustrates a cut-away side view of the pressurization apparatus 120in system 100. As shown, a wall of the pressurization apparatus 120 isattached flush against an outer face of the die tool 110. In certainexemplary embodiments, a wall of the apparatus 120 is bolted to the dietool 110 in a manner that forms a seal suitable for maintaining acontrolled air pressure in the pressurization chamber. Thepressurization chamber is identified by reference number 310 in FIG. 3.

As the substrate 130 exits the die tool 110, it moves directly into thepressurization chamber 310 formed by the pressurization apparatus 120. Awall of the apparatus 120 may include an entry aperture through whichthe substrate 130 may pass and enter the chamber 310. The entry aperturemay be any suitable two-dimensional configuration through which thesubstrate 130 can pass. The entry aperture may or may not fit theprofile of the substrate 130. In certain implementations, the entryaperture may be substantially larger than the profile of the substrate130 inasmuch as an exit aperture 240 of the die tool 110 may beconfigured to form a seal around the substrate 130, which seal canfunction as a seal between the coating chamber and the pressurizationchamber 310, especially when the pressure level in the coating chamberof the die tool 110 is greater than the pressure level in thepressurization chamber 310.

While the coated substrate 130 is in the pressurization chamber 310, thepressure level in the chamber 310 may be maintained at a level designedto prevent moisture within the substrate 130 and/or the applied coatingmaterial from “steaming off,” or to at least minimize the amount ofmoisture that “steams off.” In certain applications, the pressure levelwithin the chamber 310 in effect raises the boiling point of moistureincluded in the substrate 130 and/or the applied coating material ascompared to what the boiling point of the moisture would be atatmospheric pressure. Accordingly, subjecting the substrate 130 and/orcoating material to a higher pressure environment as compared toatmospheric pressure upon exit of the substrate 130 from the die tool110 may reduce and/or even eliminate moisture “steam off” that mayotherwise occur after a coating material has been applied to thesubstrate 130 at a high temperature and pressure in the die tool 110.Hence, the pressurization apparatus 120 may be employed to expand thetypes of substrate products and/or coating materials that can be used incoating processes. For example, a wood product or wood-based productthat may experience “steam off” when the pressurization apparatus 120 isnot used in a coating process may experience no “steam off,” or at leastreduced “steam off,” when the pressurization apparatus 120 is employedin the coating process.

The pressurization chamber 310 may provide time for the temperature ofthe substrate 130 to cool at a controlled pressure level so that whenthe substrate 130 exits the pressurization chamber 310 and is subjectedto atmospheric pressure, the temperature of the substrate 130 may havecooled to a point that “steam off” does not occur, or the amount of“steam off” that occurs is minimized. The time that a portion of asubstrate 130 is in the pressurization chamber 310 may be referred to as“dwell time.”

The amount of cooling that occurs in the pressurization chamber 310 maybe determined based one or more factors, including the size of thepressurization chamber 310 (e.g., the length of the chamber throughwhich the substrate 130 passes), temperatures within the chamber 310,the dwell tile of the substrate 130 in the chamber 310, and the speed atwhich the substrate 130 passes through the chamber 310. One or more ofthese factors may be adjusted to suit a particular coating application.For example, the length of the chamber 310 and/or the substratepass-through rate may be adjusted such that a desired amount of coolingmay take place within the pressurized chamber 310 while the substrate310 is subjected to controlled pressure.

For certain exemplary coating applications, the apparatus 120 may beapproximately twelve inches to twenty four inches (12-24 inches) inlength, the air pressure in the chamber 310 may be approximately five toeighty pounds per square inch (5-80 psi), and the speed at which thesubstrate 130 is passed through the pressurization chamber 310 may beapproximately ten to two hundred feet per minute (10-200 ft/min). Thesesettings are illustrative only. Other settings may be used in otherapplications.

The substrate 130 may be fed through the die tool 110 and pressurizationapparatus 120 in any suitable manner, including any of the waysdescribed in the '086 patent, for example. As shown in FIG. 1, thepressurization apparatus 120 may include an exit plate assembly 150forming an exit aperture through which the substrate 130 eventuallyexits the pressurization apparatus 120. The exit aperture of the exitplate assembly 150 may form a seal about the substrate 130 that allowsthe pressure in the pressurization chamber 310 to be controlled. Incertain embodiments, the exit aperture is a two-dimensional profile ofthe substrate 130. In certain embodiments, the exit plate assembly 150is configured to be removably attached to and removed from a wall of thepressurization apparatus 120. Accordingly, exit plate assemblies 150having different profile exit apertures can be conveniently swapped inand out of place based on the profile of a substrate 130 to be coated.

In certain embodiments, the exit plate assembly 150 may form anadjustable seal about the substrate 130, which seal may be adjusted tohelp control the pressure level in the pressurization chamber 310. Forexample, the seal may be tightened to fit more snugly about thesubstrate profile. The tighter seal may allow a higher pressure level tobe maintained in the pressurization chamber 310. Conversely, a looserseal may facilitate maintaining a lower pressure level in thepressurization chamber 310.

An adjustable exit seal may be provided in any suitable manner. Forexample, an exit seal tool having an exit aperture may be positionedbetween the exit plate assembly 150 and a wall of the pressurizationapparatus 120. The exit seal tool may comprise a material (e.g., rubber)that allows the exit seal tool to change shape based on the pressureplaced on the exit seal tool. For example, with the exit seal toolplaced between the exit plate assembly 150 and a wall of thepressurization apparatus 120, the exit plate assembly 150 and the wallmay be squeezed together, such as by tightening the exit plate assembly150 to the wall, to tighten the seal. The exit seal tool may respond tothe squeezing by encroaching into the exit aperture and thereby forminga tighter seal about the substrate 130. Conversely, the exit plateassembly 150 and the wall may be moved apart to loosen the seal. Inother embodiments, an exit seal tool may be placed between two exitplates included in the exit plate assembly 150 and attached to a wall ofthe pressurization apparatus 120. The two exit plates may be squeezedtogether and/or moved apart to respectively tighten and/or loosen theseal.

In certain embodiments, the pressurization apparatus 120 may include oneor more alignment mechanisms 160 for aligning the substrate 130 to passthrough the exit aperture formed by the exit plate assembly 150. Thealignment mechanisms 160 may be configured to align the substrate 130vertically and/or horizontally in relation to the exit aperture. FIGS. 1and 3 show exemplary alignment mechanisms 160, each of which includes analignment roller positioned within the pressurization chamber 310. Theposition of the roller may be adjusted for guiding the substrate 130through the exit aperture of the exit plate 150. In certain embodiments,the alignment roller may be adjusted inwardly toward and outwardly awayfrom the substrate 130 in the pressurization chamber 310. Adjustmentsmay be made in any suitable manner. In the example shown in FIGS. 1 and3, each alignment mechanism 160 includes an adjustment control (e.g.,knobs) positioned externally of the pressurization chamber 310. Theadjustment control may be used (e.g., manually rotated by an operator)to adjust the position of the alignment roller within the pressurizationchamber 310. The adjustable alignment mechanisms 160 may be especiallyhelpful for configuring the apparatus 120 to accommodate various degreesof bowing in various substrate products (e.g., decorative moldings).

In certain embodiments, the pressurization apparatus 120 may include aquick-release top allowing for quick access to and/or sealing orunsealing of the pressurization chamber 310. The quick-release top mayalso provide convenient operator access inside the pressurizationapparatus 120. As shown in FIG. 1, the pressurization apparatus 120 mayinclude quick-release mechanisms 170 for use in quickly securing orremoving the top of the pressurization apparatus 120. The exemplaryquick-release mechanisms 170 and quick-release top are illustrativeonly.

FIGS. 4 and 5 illustrate perspective views of the pressurizationapparatus 120. FIG. 4 illustrates an end plate forming an entry aperture410 through which the substrate 130 may enter the pressurization chamber310 from the die tool 110. In the example of FIG. 4, the entry aperture410 is configured to allow substrates 310 having various sizes, shapes,and profiles to pass through into the pressurization chamber 310. Thatis, the profile of the entry aperture 410 is not designed specificallyfor a particular substrate profile. Accordingly, various substrates 310may enter the pressurization chamber 310 without having to swap out theend plate forming the entry aperture 410. As described above, the exitaperture of the die tool 110 may be configured to form a seal about thesubstrate 310 that can function as a seal for the pressurization chamber310. Accordingly, the entry aperture 410 can be significantly largerthan the profile of a substrate 130.

FIG. 5 illustrates an exemplary exit aperture 510 formed by the exitplate assembly 150. As shown, the exit aperture 510 may be configured tofit a specific substrate profile and to form a seal about the substrate130.

FIG. 6 is an exploded perspective view of components of an exemplarypressurization apparatus 120. As shown in FIG. 6, the pressurizationapparatus 120 may include a bottom plate 610, side plates 620, endplates 630, top plate 640, gasket 650, alignment exit plate 660, exitseal tool 670, exit plate 680, alignment mechanisms 160, andquick-release mechanisms 170. These components may be attached to oneanother in any way suitable to form the pressurization apparatus 120shown in FIGS. 4 and 5. The components may be made of any suitablematerial, including metals, plastics, rubber, or combination orsub-combination thereof.

FIG. 7 illustrates an exemplary pressurization and coating system 700including die tool 110 and pressurization apparatus 120 implementedtherein. System 700 may include a coating material reservoir 710, acoating extruder 720, and die tool 110 attached to one another such thata coating material may travel from the reservoir 710 to the extruder 720and to die tool 110 for application to the substrate 130 as thesubstrate 130 passes through the die tool 110.

System 700 may further include a heater 730 attached to the reservoir710 and the extruder 720 and configured to heat the coating material toa fluid state. The coating material placed within reservoir 710 may beheated by heater 730 to a liquefied or fluid temperature state thatallows the coating material to flow via a pump or by gravity to theextruder 720. As the coating material now is in a liquid or fluid state,it may travel to the coating chamber formed within the die tool 110 viathe coating material feed 250. In certain embodiments, the coatingmaterial may surround the perimeter of the exit aperture 240 in the dietool 110. Once a sufficient amount of coating material collects withinthe coating chamber and along the perimeter of the exit aperture 240,the coating material is ready to be applied to the substrate 130 as thesubstrate 130 passes through the die tool 110.

System 700 may further include a feeder assembly 740, which may beconfigured to feed the substrate 130 to be processed and coated duringoperation. The feeder assembly 740 may include any suitablemechanisms(s) configured to feed a substrate 130 through the die tool110 and the pressurization apparatus 120, including a motorized beltdrive 750 pressed against the substrate 130 and configured to controlthe delivery rate of the substrate 130 through the die tool 110 and thepressurization apparatus 120. As the substrate 130 passes through thedie tool 110, a coating material is applied directly to the surface ofthe substrate 130 in a controlled manner or within the tolerancesallowed by the die tool 110 relative to the substrate surface.

When the substrate 130 exits the die tool 110 and enters thepressurization chamber 310 in the pressurization apparatus 120, thecontrolled pressure within the chamber 310 may function to reduce oreliminate moisture steam off, as described above. Pressurization tools755 (e.g., an air compressor, air hose, and gauge) may be attached topressurization apparatus 120 and used to provide air and/or other gasesto the pressurization apparatus 120 to produce and monitor thecontrolled pressure environment in the pressurization chamber 310. Anexit assembly 760 may receive the substrate 130 after the substrate haspassed through the die tool 110 and the pressurization apparatus 120.

Examples of products that may be coated using the pressurization andcoating systems, apparatuses, methods, and principles described hereininclude, but are in no way limited to, base and crown molding forresidential and commercial construction, trim work for interior andexterior applications, decorative finish carpentry products, pictureframe surfaces, window coverings (e.g., blinds and shutters), metal trimand finish work, planks (e.g., 4′×8′ panels), and siding (e.g., metaland vinyl siding). These examples are illustrative only and not limitingin any sense. Other products may be coated in other embodiments andapplications.

FIG. 8 illustrates an exemplary pressurization coating method. WhileFIG. 8 illustrates exemplary steps according to one embodiment, otherembodiments may omit, add to, reorder, and/or modify any of the stepsshown in FIG. 8.

In step 810, a substrate 130 is fed through the die tool 110 and thepressurization apparatus 120. Step 810 may be performed in any waydescribed above, including using feeder assembly 740 to feed thesubstrate 130.

In step 820, a coating material is applied to the substrate 130. Step820 may be performed in any way described above, including pre-treating(e.g., heating) the coating material, providing the coating material tothe die tool 110, and applying the coating material to the substrate 130as the substrate 130 is fed through the die tool 110.

In step 830, the substrate 130 is received in the pressurization chamber310 of the pressurization apparatus 120. Step 830 may be performed inany way described above, including receiving the substrate 130 directlyfrom the die tool 110.

In step 840, pressure about the substrate 130 in the pressurizationchamber 310 is controlled. Step 840 may be performed in any of the waysdescribed above, including controlling an air pressure level within thepressurization chamber 310. The pressure may be set to and/or maintainedat a pressure level that may serve a particular embodiment and/orcoating application.

In certain applications, the pressure level is maintained at a levelbetween a pressure level in the die tool 110 and atmospheric pressure.The controlled pressure within the pressurization chamber 310 may to setto reduce or eliminate “steam off” of moisture from the substrate 130,as described above.

In step 850, the substrate 130 is received from the pressurizationchamber 310. Step 850 may be performed in any way described herein,including the exit assembly 760 receiving the substrate 130 as it exitsfrom the pressurization apparatus 120.

The pressurization systems, methods, and apparatuses described hereinmay be employed in a variety of coating processes using various coatingmaterials and various substrate materials in a manner that can eliminateor at least reduce “steam off” and/or other flash events that mayotherwise be introduced by volatile materials in the substrates.Examples of such volatile materials include, but are not limited to,moisture or any other material that may react undesirably when subjectedto a sudden change in environmental temperature and/or pressure.Volatiles may be naturally or synthetically included in substratematerials. As one example, water moisture in woods, plastics, metals,and other materials may be considered to be volatile when subjected to asudden decrease in environmental temperature and/or pressure. Theprinciples described herein may be employed to eliminate or at leastreduce the amount of “steam offs” or other flash events that mayotherwise occur in such products.

Volatiles may also be present or introduced in coating materials. Theprinciples described herein may be employed in coating processes toeliminate or at least reduce “steam off” and/or other flash events thatmay otherwise be introduced by volatile materials in the coatingmaterials. Accordingly, the principles described herein may be employedin coating processes to protect substrates and/or coating materials fromunwanted flash events.

The principles described herein may be employed to protect materialsthat do not normally include volatile materials. As an example, acertain plastic substrate or coating material may not normally includemoisture, but manufacturing processes may inadvertently introducemoisture into such a plastic substrate or coating material. Whenemployed, the principles described herein may protect the plasticsubstrate or coating material from experiencing a flash event due tounsuspected moisture included therein. Accordingly, the principlesdescribed herein may be employed in a wide variety of coating processesto protect a variety of materials against flashing events that mayotherwise be caused by any of a number of volatiles in the materials.

The preceding description has been presented only to illustrate anddescribe exemplary embodiments with reference to the accompanyingdrawings. It will, however, be evident that various modifications andchanges may be made thereto, and additional embodiments may beimplemented, without departing from the scope of the invention as setforth in the claims that follow. The above description and accompanyingdrawings are accordingly to be regarded in an illustrative rather than arestrictive sense.

What is claimed is:
 1. A system, comprising: a die tool configured toapply a coating to a substrate; a pressurization chamber attached to thedie tool; an adjustable exit seal that defines an exit aperture and thatprovides a substrate egress from the pressurization chamber; a firstfastener disposed near a first portion of the adjustable exit seal; anda second fastener disposed near a second portion of the adjustable exitseal, wherein the first fastener is configured to apply a firstadjustable pressure to the first portion of the adjustable exit seal,and wherein the second fastener is configured to apply a secondadjustable pressure to the second portion of the adjustable exit seal.